What you do at AMD changes everything
At AMD, we push the boundaries of what is possible. We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies building blocks for gaming, immersive platforms, and the data center.
Developing great technology takes more than talent: it takes amazing people who understand collaboration, respect, and who will go the extra mile to achieve unthinkable results. It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world. If you have this type of passion, we invite you to take a look at the opportunities available to come join our team.
The role and key Responsibilities:
Candidate will act as the primary interface with EDA vendors, SOC foundries and packaging OSAT to develop internal 2.5D/3D package EDA reference flows. He/She will also work closely with internal SoC and packaging design teams to define and deploy the reference flows.
Skills and experience:
- Development level understanding of 2.5D/3D packaging EDA reference flows and EDA landscape
- Tool development and automation experience forCadence APD/SIP,Cadence Innovus,Cadence Virtuoso, Mentor Xpedition, Zuken Design Force, Valor, DRC/LVS, etc
- Package design and SOC design flow understanding from netlist creation to IC Tape out and Package tooling
- Strong experience of interaction with internal and external EDA and internal stakeholders
- Excellent interpersonal and analytical skills with the ability to work independently
Academic Qualification:
Bachelors/Masters/PhD in mechanical, electrical, chemical, or material engineering
Requisition Number:177286
Job Function:Design
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